The development of Russia’s first domestically produced lithography system, which is capable of fabricating microchips using a 90-nanometer (nm) process node, is set to start in 2026. This information was disclosed in late March by the Deputy Minister of Industry of the nation. The announcement is coupled with the confirmation that Russia has already developed a 350 nm lithography machine and is on the brink of completing a more sophisticated 130 nm system. These developments collectively represent a critical juncture in Russia’s quest to revitalize its microelectronics sector and diminish its dependence on foreign semiconductor technologies.
The Strategic Significance of Lithography
The foundation of semiconductor manufacturing is lithography equipment. The production of integrated circuits is facilitated by the projection and etching of intricate circuit patterns onto silicon substrates by these highly sophisticated systems. True independence in the production of microelectronics is impossible in the absence of domestic lithography capabilities.
Russia lacked of this capability for a long time. The domestic development of lithographic equipment was effectively halted at the 350 nm level following the collapse of the Soviet Union in 1991. In the interim, global semiconductor leaders made significant progress, transitioning to process nodes that were both smaller and more potent.
Russia was compelled to rely significantly on imported equipment as a result of this technological gap. This dependence became a major vulnerability, particularly after 2022, when sanctions and geopolitical disruptions restricted access to foreign technologies. As a result of these events, there was a strategic transition that led to a resurgence in investment in the development of domestic semiconductors.
Rebuilding from the Ground Up: The 350 nm Revolution
The first significant outcome of this renewed emphasis was the creation of Russia’s first 350 nm lithography system in nearly 35 years. This machine, which was completed in 2025 and is now ready for serial production, is a groundbreaking accomplishment.
Despite the fact that 350 nm technology is considered obsolete by current global standards, it continues to play a critical role. Engineers can reestablish their expertise, rebuild industrial capabilities, and test production processes. Essentially, it establishes the foundation for more sophisticated developments.
The initiative also benefited from the collaboration with specialists who had experience in Soviet-era lithography, which helped to resurrect knowledge that had been dormant for decades.
An Important Development: The Transition to 130 nm
Russia is currently in the process of finalizing its first domestic 130 nm lithography system, which is expected to be completed by the end of 2026, following the 350 nm milestone. This is a huge technological development.
The 130 nm node became extensively used for the production of a variety of semiconductor devices in the early 2000s, and it became mainstream globally. However, in the past, these capabilities were exclusively acquired through the procurement of equipment in Russia.
The production of “mature node” semiconductors is anticipated to be facilitated by the new domestic 130 nm system. Microcontrollers, automotive electronics, banking cards, passport processors, sensors, and power electronics comprise this category. Although not state-of-the-art, these components are indispensable for an extensive array of sectors.
It is crucial to note that 130 nm technology continues to be extremely important due to its cost-effectiveness and reliability. Russia can establish its independence in this critical semiconductor market segment by creating its own system.
A Strategic Advance: The 90 nm Initiative
The forthcoming 90 nm lithography system is the succeeding phase of Russia’s technological development. Development will start in 2026, with the expectation that a functional system will be achieved formally within two to three years.
90 nm technology continues to be extensively employed in 2026, despite its global introduction in the mid-2000s. It is the optimal choice for the production of circuits that necessitate reliability over extreme performance.
Internet of Things (IoT) devices, automotive electronics, RFID tags, SIM cards, power management processors, and a variety of sensors are among the applications. The backbone of modern electronic infrastructure is made up of these components.
The development of a domestic 90 nm capability would considerably enhance Russia’s technological sovereignty by enabling the production of essential semiconductors using entirely homegrown equipment.
Historical Context: Unrealized Possibilities
The current emphasis on domestic lithography is also indicative of the lessons learned from previous decisions. There was a transition from the development of original designs to the imitation of foreign computing architectures during the late Soviet period. Innovation and technological advancement were hindered by this methodology.
A comparable pattern evolved during the post-Soviet period. In the late 2000s, the emphasis was on the acquisition of foreign equipment rather than the investment in domestic development, as financial resources became available. Consequently, Russia acquired imported lithography systems at the 130 nm and 90 nm levels, but it was unable to establish its own manufacturing base.
These imported technologies had already begun to deteriorate by the early 2010s. In the interim, the country’s reliance on external production capabilities was underscored by the necessity of manufacturing domestically designed processors abroad.
A pivotal year in 2022
The 2022 events were a major turning point for the microelectronics industry in Russia. The hazards of relying on foreign technology were exposed by sanctions and supply chain disruptions.
The government initiated a comprehensive initiative to rehabilitate domestic capabilities in response. This encompassed the financing of research and development, the support of industrial partnerships, and the revitalization of critical technological competencies.
The development of lithography systems is an exceptionally complicated effort. It necessitates proficiency in software, precision engineering, materials science, and optics. The challenge became worse by the fact that many of these areas had been underdeveloped for years.
Progress has been consistent in spite of these challenges. The industry’s reconstruction is illustrated by the transition from 350 nm to 130 nm and current progress toward 90 nm, which is characterized by order and structure.
Future Prospects: Beyond 90 nanometers
Even more sophisticated nodes, such as 65 nm, may be developed within the next three to four years, according to future plans. Although this would still place Russia behind global leaders, it would greatly improve its position in the mature semiconductor segment.
This segment continues to be of major importance, as it accounts for a significant portion of the global semiconductor production. These technologies are extensively used in industries such as automotive manufacturing, industrial automation, and IoT.
Russia can establish a self-sufficient and stable semiconductor ecosystem that is customized to its domestic requirements by concentrating on these sectors.
Conclusion: A Strategic Reawakening
The beginning of a 90 nm lithography development program in 2026 is not just a technological milestone; it also indicates a more extensive cultural transformation. Russia is currently making tangible strides toward the reconstruction of its microelectronics industry, following decades of dependence on foreign technologies.
The progress is both tangible and significant, spanning from the revival of 350 nm systems to the near-completion of 130 nm technology and the planned transition to 90 nm. Each stage contributes to the restoration of capabilities that had been lost for more than thirty years.
The direction is evident, despite the fact that challenges persist. Russia is establishing a foundation for increased technological autonomy by emphasizing mature and dependable technologies.
The development of domestic 90 nm lithography could become a defining moment in the country’s ongoing effort to reclaim control over its semiconductor future if sustained investment and strategic consistency persist.