Russia has been placing a greater emphasis on achieving technological independence in the field of microelectronics in recent years, as this sector is essential for both national security and the global economy. The introduction of a domestic production facility for silicon crystals and wafers is one of the most major developments in this regard. A project to establish serial production of silicon monocrystals and wafers for microelectronics and solar energy applications within Russia was announced by the NTI Sovereign Technologies Fund (FST NTI) at the end of January 2026. The investment totaled 50 million rubles.
The project establishes ambitious objectives: by 2028, it is expected that production will exceed one million semiconductors annually with diameters of up to 300 mm. This would be a significant improvement in comparison to the current domestic output. To provide context, Russia manufactured approximately 145,000 silicon wafers with a diameter of 200 mm in 2024.
The Project and Its Participants
The project is strategic in nature, with the objective of establishing a technological chain that is entirely domestic in nature. This chain will be responsible for the production of one of the most critical materials that underpin modern microprocessors, microcontrollers, specialized chips, and solar panel components.
The NTI Sovereign Technologies Fund, which was established under Russia’s National Technology Initiative, is the principal investor and initiator. In 2018, the Russian government established this nonprofit organization to provide assistance to promising high-tech markets and industries, notably in the face of limited access to foreign technologies and harsh external sanctions.
In 2020, Popov Radio Corporation JSC, a Russian company that was registered with the participation of the Interstate Development Corporation, became a co-investor in the initiative. The company’s practical expertise in radio-electronic manufacturing, which complements the project’s research and engineering focus, is associated with the Omsk A.S. Popov Radio Plant.
The initial investment of 50 million rubles serves as seed funding for the initial phase of development. However, experts estimate that the total investment necessary to establish a complete industrial production chain will be in the tens of billions of rubles, and this includes the costs of equipment, certification, scaling, and factory construction. As opposed to a full-scale manufacturing facility, the current funding is primarily viewed as a starting budget for research and development, pilot installations, and technology refinement.
Production Technology: Wafers to Monocrystals
The manufacturing of silicon wafers is divided into two primary stages: the growth of high-purity silicon monocrystals and their subsequent processing into thin wafers.
Growing Silicon Monocrystals
The large cylindrical single crystals from which silicon wafers are made must be structurally defect-free, uniform, and exceedingly pure. The Czochralski method, which continues to be the most common industrial technique for the production of silicon monocrystals on a global scale, is being used in the project.
A crystal is extracted from molten silicon using this method, which takes place under meticulously monitored conditions. The crucible walls are not in contact with the growing crystal, which substantially reduces contamination and enables the formation of highly pure crystals. This is one of its primary advantages.
Engineers have created a proprietary crystal growth technique for this project that is based on a modified Czochralski method. In order to decrease the cost of both monocrystal and wafer production, increase yield, improve reliability, and extend the longevity of equipment, a variety of technical innovations—referred to as “know-how”—have been implemented. The system is essentially a vacuum furnace that is equipped with an automated process control system, which demonstrates a high degree of digitalization and precision in crystal growth.
Industry analysts observe that the design of the growth equipment, automation systems, and process regimes that enhance yield and quality stability is typically where competitive advantage is ingrained in projects of this nature.
Manufacturing of Wafers
Upon achieving the necessary dimensions, a silicon monocrystal is cut into narrow discs, which are referred to as silicon wafers. The diameter of the wafer is an essential technological parameter, as the larger the wafer, the greater the surface area available for chip fabrication.
Until recently, Russian facilities were primarily concerned with 200 mm (8-inch) wafers, whereas current global semiconductor manufacturing has been standardized on 300 mm (12-inch) wafers. The vast majority of advanced microchips produced worldwide are currently manufactured using 300 mm wafers, which provide a substantially higher level of productivity and a lower cost per chip.
Why 300 mm wafers are significant
A critical technological milestone is the realization of the ability to produce 300 mm silicon wafers. Manufacturers can produce a greater number of chips per wafer with larger wafers, which results in a decrease in unit costs and an improvement in overall economic efficacy.
Russia has not yet implemented an extensive domestic production of 300 mm wafers. The majority of these wafers used by Russian electronics manufacturers were imported from Asia. This dependence resulted in vulnerabilities associated with geopolitics, logistics disruptions, and export restrictions.
These vulnerabilities are directly addressed by the development of domestic 300 mm wafer production, which strengthens technological sovereignty and reduces dependence on foreign suppliers—an especially critical factor in the current international environment.
Production Volumes and Development Strategies
The facility’s objective is to manufacture up to one million silicon wafers annually with diameters of up to 300 mm by 2028, as stated by project representatives. This level of output would be adequate to meet quite a bit of domestic demand and facilitate the growth of Russia’s microelectronics sector.
For instance, in 2024, Russian factories manufactured approximately 145,000 silicon wafers, all of which were in the 200 mm format. Therefore, the proposed expansion is an important leap in both technological sophistication and scope.
In the future, the developers of the project foresee that export sales will comprise up to 50% of the total revenue between 2030 and 2032. This suggests that the organization has aspirations to compete on a global scale, in addition to meeting domestic demand.
Economic and Geopolitical Context
Investment Requirements and Obstacles
Experts warn that the first 50 million ruble investment is modest in comparison to the capital intensity of wafer fabrication, despite the optimistic outlook. Typically, investments in the billions of dollars are required for large-scale 300 mm wafer fabs on a global scale. Despite the conditions in Russia, which include localized equipment and a focus on specific wafer classes, it is anticipated that total capital expenditures will exceed tens of billions of rubles.
Securing follow-on funding and transitioning from early-stage R&D to industrial-scale production will be a significant challenge. It is equally crucial to establish long-term contracts for major consumers, such as state-backed microelectronics manufacturers. Scaling a capital-intensive undertaking of this nature becomes considerably more challenging in the absence of guaranteed demand.
Governmental Assistance and Technological Independence
The project’s stability is substantially improved by the participation of state-linked funds and corporations. The broader strategy of Russia to attain technological independence in critical industries is significantly influenced by government support.
The strategy incorporates the development of domestic lithography tools, chip design capabilities, photomask manufacturing, and other essential elements of the semiconductor value chain, in addition to wafer production. All of these downstream activities are founded on the fabrication of silicon wafers.
Outlook for the Silicon Wafer Market
The global silicon wafer market is still sizable and is expected to continue expanding, as per industry analysts. The market is anticipated to be worth $14–15 billion by 2025, with projections exceeding $20 billion by 2030. The 300 mm segment is experiencing particularly robust growth, which is being driven by the increasing capacity of advanced logic and memory processors.
Additionally, the Russian market is expected to grow due to the increasing demand for microelectronics, solar energy, and industrial sensor applications, as well as import substitution policies and government support.
In conclusion,
The establishment of a domestic silicon monocrystal and wafer manufacturing industry in Russia is a strategically significant step in the direction of enhancing the nation’s technological sovereignty. The project integrates proprietary engineering solutions, public and private investment, and long-term objectives to serve both domestic and export markets.
A significant milestone for Russia’s semiconductor ecosystem will be achieved if the objective of producing up to one million 300 mm wafers annually is met, as it will establish a critical material foundation for advanced electronics manufacturing. Simultaneously, the initiative encounters significant obstacles in the areas of technology maturation, investment scale, and market competition.
In the broader context of global technological fragmentation and supply chain reconfiguration, this initiative is a substantial effort to establish Russia’s position in one of the most strategically significant industries of the 21st century.