In January 2026, the Zelenograd Nanotechnology Center (ZNTC)—known for developing Russia’s first advanced domestic lithography system—formally inaugurated a new chip packaging line for polymer containers, capable of processing up to 100,000 chips per month. This event signifies an important moment for the Russian microelectronics industry, as chip packaging is a crucial stage that converts silicon dies into fully functional electronic components.
The new line is located in Zelenograd and represents an important technological accomplishment. It functions with 200 mm and 300 mm silicon wafers, accommodates advanced packaging configurations, and is supported by a state-of-the-art industrial infrastructure comprising 1,350 square meters of cleanroom facilities and 161 units of process equipment.
The launch signifies a new stage in the decentralization of critical semiconductor manufacturing processes within Russia and aids in decreasing reliance on foreign service providers, who currently hold a dominant position in the chip packaging market.
Why Chip Packaging Is a Critical Stage in Semiconductor Manufacturing
The semiconductor manufacturing process comprises numerous intricate stages that can be generally categorized into two primary phases: the fabrication of semiconductor structures on silicon wafers and subsequent packaging, wherein the bare die is encased in a protective package with electrical contacts appropriate for integration into electronic systems.
Before packaging, a microchip is a delicate silicon crystal featuring exposed contact areas. To be mounted on printed circuit boards and used within electronic systems, it must be equipped with electrical interconnections, contact balls or leads, mechanical protection, and thermal management components. All of these functions are supplied by the package, which additionally influences electrical performance, thermal dissipation, and long-term reliability.
For many years, Russian manufacturers have depended extensively on foreign packaging services owing to inadequate domestic capacity. According to industry data, approximately 94 percent of packaged chips available in Russia are imported, whereas domestic producers constitute only about 6 percent of the market.
Technical Capabilities of the New Packaging Line
The introduction of the new packaging line at ZNTC markedly enhances the technological capabilities of the Russian microelectronics industry across multiple dimensions.
First, the range accommodates two wafer formats. 200 mm wafers continue to serve as the main format for the majority of Russian semiconductor fabrication facilities, whereas 300 mm wafers constitute the international industry standard for high-volume and high-performance chip manufacturing.
Secondly, the line accommodates a broad spectrum of sophisticated packaging types.
PBGA (wire bond) packaging accommodates up to 1,000 contact pads and are usually used for peripheral and moderately complex integrated circuits.
FC-BGA (flip-chip) packaging accommodates up to 2,500 contact pads, providing enhanced electrical performance and increased density through direct connection of the die to the substrate.
HFCBGA (flip-chip with heat spreader) devices accommodate up to 8,000 contact pads and are specifically engineered for high-performance processors and ASICs that necessitate advanced thermal management.
This degree of flexibility enables the facility to accommodate a wide spectrum of clients, including general electronics manufacturers as well as developers of sophisticated systems for the aviation, automotive, telecommunications, and defense sectors.
Project Background: From R&D to Industrial Deployment
The project was carried out within the framework of a completed research and development (R&D) program titled “Development and Serial Implementation of Technologies for Packaging High-Performance Microchips in Multi-Lead Polymer Packages.” The program was initiated in August 2023 pursuant to a contract with the Ministry of Industry and Trade of the Russian Federation, with a total budget of approximately 1.4 billion rubles.
The research and development initiative extended well beyond just the construction of the packaging line. A primary goal was the development of domestic materials to substitute imported components that were used in semiconductor packaging.
These included hermetic sealing compounds and encapsulation materials, which were developed by experts from the Institute of Problems of Chemical Physics of the Russian Academy of Sciences. This accomplishment markedly decreased dependence on foreign chemical supplies essential to semiconductor packaging.
Simultaneously, Russian companies devised technologies for forming metallization layers for solder ball contacts. For 200 mm wafers, the process was carried out at the Mikron semiconductor facility, whereas the development of 300 mm wafer technologies was undertaken by SP Kvant, a subsidiary of the Rosatom State Corporation. The final packaging technology, system integration, and testing of prototype products were conducted at ZNTC, where the trial quantities successfully underwent validation.
Significance for Import Substitution and Domestic Microelectronics
Amid ongoing geopolitical tensions and technological restrictions, Russia has intensified its endeavors to attain technological sovereignty in the field of microelectronics. Although multiple domestic packaging facilities are already in operation, their scope and technical capacities have been inadequate to satisfy the national demand.
Before the introduction of the ZNTC line, the Russian packaging industry was predominantly reliant on foreign providers, thereby subjecting chip producers to risks including elevated service expenses, extended lead times, constrained coordination, and increased vulnerability in strategically vital sectors.
With a capacity of up to 100,000 packaged wafers per month, the new ZNTC facility ranks among the largest of its kind in Russia. It is anticipated that packaging services will be offered to a diverse array of domestic clients, encompassing industrial manufacturers, semiconductor design centers, and innovative technology firms.
Industry Evaluations and Prospective Outlook
Industry experts typically regard the start of the ZNTC packaging line as an important step that enhances localization efforts and bolsters the robustness of Russia’s semiconductor supply chain. The development of these facilities improves the capacity of domestic companies to control advanced manufacturing processes independently, reducing dependence on foreign contractors.
Simultaneously, certain analysts have expressed caution. They observe that Russia currently possesses several smaller packaging facilities, and there is a potential danger of resource fragmentation rather than the consolidation into a few large, globally competitive centers. Numerous existing facilities operate at reduced production levels, rendering it difficult to compete with established international competitors regarding cost efficiency and scale.
Nonetheless, the development of a completely domestic technological supply chain—from lithography system innovation to sophisticated semiconductor packaging—embodies a strategic, long-term effort to decrease reliance on external technologies. The initiative signifies not only symbolic advancement but also a concrete measure toward establishing a sovereign microelectronics infrastructure within Russia.
Final Remarks
The inauguration of the chip packaging facility at the Zelenograd Nanotechnology Center signifies an important step in the advancement of Russia’s microelectronics sector. By increasing domestic packaging capacity and implementing advanced technologies, the facility contributes to decreasing dependence on foreign service providers that have historically dominated this sector.
The incorporation of domestically developed materials, processes, and equipment within the finalized R&D program exemplifies a thorough approach to import substitution. Despite persistent challenges and ongoing debates regarding the ideal industry configuration, the new facility offers Russian semiconductor developers essential infrastructure to transition from design to large-scale industrial manufacturing. In the long term, it could serve as a fundamental pillar of a resilient and self-sufficient semiconductor ecosystem within Russia.