A technology for the deep purification of silicon dioxide nanopowder, a material used in the precision polishing of semiconductor wafers, has been patented by scientists at Lobachevsky University in Nizhny Novgorod. The researchers have also devised a method for regulating the properties of these nanoparticles, which has the potential to assist Russia in the establishment of a domestic source of specialized materials required for the production of microelectronics.
The university reported that a process has been devised by the research team at the Engineering Chemistry Research Laboratory of the university’s Research Institute of Chemistry to produce particles with controlled size and shape, high uniformity, stability, and low impurity levels. These characteristics are essential for producing reliable polishing materials for semiconductor fabrication.
The project addresses a part of the semiconductor supply chain that receives less public attention than chip processors, lithography machines, and fabrication plants. However, the surface quality necessary for the production of electronic components necessitates precisely engineered chemicals and materials, even in the most advanced chipmaking equipment.
The patented invention pertains to the purification of amorphous silicon dioxide, according to Ksenia Otvagina, the project leader and a researcher at the laboratory. She is a candidate of chemical sciences. It is primarily used in the chemical-mechanical polishing of semiconductor wafers, as well as in other processes that necessitate highly purified abrasive nanomaterials.
The significance of silica nanoparticles in the production of chips
CMP, or chemical-mechanical polishing, is a process that combines mechanical abrasion with chemical reactions to produce semiconductor wafers with extraordinarily flat and uniform surfaces. The process is repeated at various stages of chip manufacturing to smooth out material layers and eliminate irregularities.
Silica, or silicon dioxide, is one of the materials used in CMP slurries, which are liquid formulations that contain finely engineered abrasive particles. The particles assist in the removal of undesirable material, as well as the control of surface roughness and the prevention of defects.
The polishing procedure is directly influenced by their characteristics. Scratches, contamination, or inconsistent material removal may result from particles that are excessively large, irregular, or unevenly distributed. The reliability of the finished device can also be compromised by the presence of excessive impurities, which can interfere with process performance.
The consistency of polishing chemicals becomes a critical production requirement as semiconductor manufacturing involves progressively intricate structures and multiple layers of materials. A supplier is required to provide a material that is meticulously regulated and consistently performs under specific manufacturing conditions, rather than solely silica powder.
According to the researchers from Nizhny Novgorod, their methodology facilitates a more thorough regulation of the properties of nanoparticles. This could provide manufacturers with more control over the polishing performance, although the technology’s commercial competitiveness will ultimately be contingent upon industrial testing and qualification.
From laboratory research to industrial testing
The project has advanced beyond the preliminary research phase. The material has been manufactured using a technological production line and a process specification that the university has developed. Additionally, researchers have generated a stable suspension that has been forwarded to an industrial partner for assessment.
Work on the project began in 2024 under the strategic initiative “New Materials for Microelectronics,” which is a component of the federal Priority-2030 program, according to supplementary reporting by the Russian technology publication CNews. The experimental work on the selection of the composition and synthesis conditions had been substantially completed by October 2026. The subsequent obstacle is to demonstrate that the process remains consistent as production is increased.
This distinction is crucial. A patent safeguards an invention; however, it does not necessarily guaranty that the resulting product can compete commercially with established international materials. Extensive testing is necessary for semiconductor manufacturers to confirm the purity, particle-size distribution, shelf stability, polishing performance, and compatibility with their current production processes.
The international market: a specialised and competitive industry
Established chemical companies with specialized formulations, production capabilities, and long-standing relationships with chip manufacturers worldwide supply semiconductor materials. In the broader semiconductor materials ecosystem, Japan, the United States, Europe, South Korea, and China all play significant roles.
The sophistication of this market is exemplified by Japanese companies like Fujimi and FUJIFILM. For example, Fujimi’s PLANERLITE 4000 series polishes silicon dioxide films using ultra-high-purity colloidal silica or fumed silica. Tungsten, copper, polysilicon, and barrier-metal applications are addressed by its other product families.
These products serve as evidence of the significance of the Russian university’s research: semiconductor-grade abrasives are engineered materials, as opposed to standard industrial silica. Purity, particle characteristics, formulation, and the specific requirements of each polishing procedure are all factors that influence their performance.
Artificial intelligence and advanced packaging are also influencing international competition. The significance of uniform surfaces and dependable process chemicals is heightened by the necessity of complex multilayer structures for more advanced processors and high-bandwidth memory. For example, Fujifilm has identified advanced logic, memory, and semiconductor packaging as critical areas for its CMP slurry business.
The incentive to develop local alternatives has been heightened in Russia as a result of the restricted access to certain foreign technologies and supply chains. However, international suppliers have amassed a wealth of manufacturing expertise and process expertise that is tailored to the unique requirements of each customer. Consequently, it is imperative that a novel domestic material demonstrate its ability to be manufactured and its ability to produce reproducible results at a reasonable cost.
In conclusion,
The patented silica purification technology of Lobachevsky University has the potential to significantly enhance the domestic semiconductor materials supply chain in Russia. The project is now closer to practical industrial application due to the development of a stable polishing suspension and a production process. However, critical milestones such as large-scale manufacturing and customer qualification remain.
The material’s ability to match the purity, consistency, efficacy, and cost of established international products will be the determining factor. The technology has the potential to reduce Russia’s dependence on imported consumables and support its broader initiative to establish a more self-sufficient microelectronics industry if industrial trials are successful.